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MoneyDJ reports that TSMC's second fab in Arizona will begin installing equipment for its cutting-edge 3nm node by mid-2026, more than a year ahead of previous ...

Japan has attracted big silicon names to set up shop in the countryAnd some of them are already getting into production with ...

China's semiconductor equipment purchases are expected to decline in 2025 after three years of growth, according to Canadian ...

ASML will launch its new high lithography machine, allowing smaller and more powerful chips. Intel will be the first to ...

This year's wafer fabrication equipment (WFE) sales to Chinese chipmakers will drop because of sanctions and overcapacity, ...

U.S. chip equipment maker Lam Research Corp commits $1.2 billion in India, boosting semiconductor ecosystem. Indian market ...

The purchase of chipmaking equipment by China is set to decline this year after three years of growth, amid challenges of overcapacity and  U.S. export curbs, Reuters reported, citing semiconductor ...

Dr. Patrick Heissler, CEO, SCRONA AG, discusses the company’s recently unveiled 128-nozzle electrohydrodynamic (EHD) ...

China's purchases of chipmaking equipment are set to decline this year after three years of growth, as the industry grapples ...

Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing ...

This week is the AI Action Summit in Paris and the European Union is using it as an opportunity to deep dive into the growing ...